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                                                                          IC Packaging

                                                                          Our IC packaging pipeline -- categorized into WBGA, LGA, FBGA-SSD, and SiP-eMCP and USB packaging -- will manufacture a variety of products including DRAM, eMCP, SiP, SSD, and LED dot matrix.



                                                                            DRAM/Flash product packaging testing

                                                                          • LED dot matrix

                                                                          • LGA packaging for fingerprint recognition chips

                                                                          • RAM module assembly