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                                  皇冠体育

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                                  Kaifa(000021.SZ)
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                                  Your current location:Home > Business > Manufacturing > SMT

                                  SMT Line

                                  Machine

                                  Brand

                                  Capability

                                  Screen Printer

                                  MPM、FUJI、INOTIS

                                     Min Pad Size:03015(0.3mm*0.15mm)

                                  3D SPI

                                  Parmi、Pemtron、Cyber Optics

                                     Min Pad Size01005(0.4mm*0.2mm)

                                  SMT Machine

                                  FUJI、Siplace、Panasonic

                                     Min Component Size03015 (0.3mm*0.15mm)
                                   
                                    Flip Chip: (Min solder bump size 68 μm, Min pitch 0.13 mm)
                                   
                                    μBGA:      (Min solder bump size 0.25mm, Min pitch 0.35 mm)
                                   
                                    IC lead :   (Min pitch 0.24mm)

                                  Reflow Oven

                                  BTU、REHM、ERSA

                                     PCB Size Range50mm-550mm

                                  AOI

                                  Omron、Jutze、Magic Ray

                                     Min Component Size01005(0.4mm*0.2mm)

                                  Wave Soldering

                                  ERSA(Wave Soldering、Selective Wave Soldering)

                                     PCB Size Range50mm-550mm


                                  Armed with advanced SMT equipment and supported by a sophisticated technical tesm, we provide extremely reliable SMT manufacturing services.

                                  • Smallest SMT component: 01005

                                  • Flip chip (minimum solder joint): 68 μm

                                  • μBGA (minimum gap between solder balls): 0.15 mm

                                  • IC lead (minimum width): 0.12 mm

                                  • Maximum PCB dimension: 500 mm × 500 mm

                                  • Minimum PCB dimension: 50 mm × 50 mm

                                  • PCB Maximum thickness: 6mm